This wafer equipment machine can cool off and stereotype the wafer, making it taste crisp.

Technology and function
Shell and insulating materials: Double-sided stainless steel plate, composite
Insulating plate of polyurethane +XPS
Cooling units: American "Valley Round" brand.
The temperature in cooling room can be set: 4° C~8° C, with air dehumidification Device.
Intensive cooling racks guarantee wafers have enough cooling time that can reach 15 Minutes.
Cooling cabinet with longer cooling time can be designed according to user needs.
External dimension(L× W× H): 3.7m× 1 m× 2.38 m
Total power: 12.25KW.